Part Number Hot Search : 
TC74HC3 HT6230 1N3036B LH28F 1N2821B 973510 ZMDK85WA AN1105
Product Description
Full Text Search
 

To Download ZTTCC-MG Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
  http://www.shoulder.cn shoulder electronics limited page: 1 shoulder electronics limited ceramic resonator data sheet product ? : ceramic resonator model no : zttc c mg prepared : fengyu checked : york approved ? : lijiating date : 2008-01-25
1 scope this specification shall c over the characteri stics of the ceramic resonator 1.84 -8.00mhz 2 part no. part number customer part no specification no zttc c mg 3 outline drawing and dimensions 3.1 appearance: no visible damage and dirt. 3.2 except the chip(ceramic elem ent, ceramic base, capacitance slice), the materials don?t contain lead. 3.3 dimensions 1.20.3 1.20.3 1.20.3 2.50.3 2.50.3 1.80.3 7.40.3 3.40.3 4.00m input ground output 4 rating and electrical specifications 4.1 rating items content withstanding voltage (v) 50 (dc 1min) insulation resistance ri, m ? min. 100 100v 1min operating temperature range ( ) -20 +80 storage temperature range ( ) -55 +85 http://www.shoulder.cn shoulder electronics limited page: 2
4.2 electrical specifications oscillation frequency fosc mhz 1.84-8.00 frequency accuracy % 0.5 resonant impedance ro ? max. 30 temperature coefficient of oscillation frequency % max. 0.3 oscillation frequency drift -20 +80 6v dc rating voltage ur v max. 15v p-p aging rate % max. 0.3 for ten years 5 measurement 5.1 measurement conditions parts shall be measured under a condition ( temp. 2015 ,humidity 65%20% r.h.) unless the standard condition(temp. 253 ,humidity 65%5% r.h.) is regulated to measure. 5.2 test circuit 6 physical and environmental characteristics no item condition of test performance requirements 6.1 humidity keep the resonator at 40 2 and 90%-95% rh for 96h4h. then release the resonator into the room condition for 1h prior to the measurement. it shall fulfill the specifications in table 1. 6.2 vibration subject the resonator to vibration for 2h each in x y and z axis with the amplitude of 1.5mm, the frequency shall be varied uniformly between the limits of 10 hz?55hz. it shall fulfill the specifications in table 1. 6.3 mechanical shock drop the resonator randomly onto a wooden floor from the height of 100cm 3 times. it shall fulfill the specifications in table 1. ic 1/6tc4069ubp2 x ceramic resonator c1,c2: 30pf(1 20% ) http://www.shoulder.cn shoulder electronics limited page: 3
passed through the re -flow oven under the following condition and left at room temperature for 1h before measurement. temperature at the surface of the substrate time preheat 150 5 60s10 s 6.4 soldering test peak 260 5 10s3 s it shall fulfill the specifications in table 1. 6.5 solder ability dipped in 250 5 solder bath for 3s0.5 s with rosin flux (25wt% ethanol solution.) the terminals shall be at least 95% covered by solder. 6.6 high temperature exposure subject the resonator to 80 5 for 96s, then release the resonator into the room conditions for 1h prior to the measurement. it shall fulfill the specifications in table 1. 6.7 low temperature exposure subject the resonator to -20 5 for 96h, then release the resonator into the room conditions for 1h prior to the measurement. it shall fulfill the specifications in table 1. to be continued 6 physical and environmenal characterisics no item condition of test performance requirements 6.8 temperature cycling subject the resonator to -40 for 30 min. followed by a high temperature of 85 for 30 min. cycling shall be repeated 5 times with a transfer time of 15s. at the room temperature for 1h prior to the measurement. it shall fulfill the specifications in table 1. board bending 6.9 mount a glass-epoxy board (width=40mm,thickness=1.6mm),then bend it to 1mm displacement and keep it for 5s. (see the following figure) mechanical damage such as breaks shall not occur. http://www.shoulder.cn shoulder electronics limited page: 4
support bar press head press table 1 item specification after test oscillation frequency change fosc/fosc (%) max 0.3 resonant impedance ( ) max 40 the limits in the above table are refe renced to the initial measurements. 7 recommended land pattern a nd reflow soldering standard conditions 7.1recommended land pattern http://www.shoulder.cn shoulder electronics limited page: 5
7.2recommended reflow soldering standard conditions peak:260 250 255 pre-heating within 10s within 80-120s. within 20-40s tem.() 8 package to protect the products in storage and transportation it is necessary to pack them outer and inner package .on paper pack, the following requirements are requested. 8.1 dimensions and mark at the end of package, the warning (moistur e proof, upward put) should be stick to it. dimensions and mark (see below) http://www.shoulder.cn shoulder electronics limited page: 6
no. name quantity notes 1 package 1 2 certificate of approval 1 3 label 1 4 tying 2 5 adhesive tape 1.2m 6 belt 2.9m 7 inner box 10 8.2 section of package package is made of corrugated paper with th ickness of 0.8cm.package has 10 inner boxes, each box has 1 reel(each reel for plastic bag) 8.3 quantity of package per plastic reel 4000 pi eces of piezoelectric ceramic part per inner box 1 reel per package 10 inner boxes 40000 pieces of piezoelectric ceramic part 8.4 inner packing dimensions 1 label 2 qc label 3 inner box pars shall be packaged in box with hold down tape upside. part no., quantity and lot no. 8.5 reel http://www.shoulder.cn shoulder electronics limited page: 7
dimensions unitmm a b w t pieces per reel carrier tape size 3303 80min 16.4min 22.4max 4000typ. 16 8.6 taping dimensions 8.7 packing method sketch map leader 200mm max loaded pocket blank pocket 10 pitches blank pocket 10 pitches http://www.shoulder.cn shoulder electronics limited page: 8
8.8 test condition of peeling strength 10max top tape p e e l i n g s t r e n g t h 2 0 - 7 0 g carrier tape 9 other 9.1 caution of use 9.1.1 do not use this product with bend. please don?t apply excess mechanical stress to the component and termin als at soldering. 9.1.2 the component may be damaged when an excess stress will be applied. 9.1.3 this specification mentions the quality of the component as a single unit. please insure the component is thoroughly eval uated in your application circuit. 9.2 notice 9.2.1 please return one of this specification after your signature of acceptance. 9.2.2 when something gets doubtful with this specif ications, we shall join tly work to get an agreement. http://www.shoulder.cn shoulder electronics limited page: 9


▲Up To Search▲   

 
Price & Availability of ZTTCC-MG

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X